![]() ELECTRONIC FAILURE ANALYSIS HANDBOOK Smith.PRINTED CIRCUIT ASSEMBLY DESIGN Martin.BALL GRID ARRAY TECHNOLOGIES Lau & Lee.PRINTED CIRCUIT BOARD MATERIALS HANDBOOK Lau.HIGH PERFORMANCE PRINTED CIRCUIT BOARDS Hwang.ELECTRONICS PACKAGING AND INTERCONNECTION HANDBOOK 3/e Harper.ELECTRONIC INSTRUMENT HANDBOOK 3/e Harman.McGraw-Hill Packaging and Electronics Books Coombs If such services are required, the assistance of an appropriate professional should be sought. This work is published with the understanding that McGraw-Hill and its authors are supplying information but are not attempting to render engineering or other professional services. However, neither McGraw-Hill nor its authors guarantee the accuracy or completeness of any information published herein, and neither McGraw-Hill nor its authors shall be responsible for any errors, omissions, or damages arising out of use of this information. ![]() (“McGraw-Hill”) from sources believed to be reliable. Information contained in this work has been obtained by The McGraw-Hill Companies, Inc. For more information, please write to the Director of Special Sales, McGraw-Hill, Professional Publishing, Two Penn Plaza, New York, NY 10121-2298. McGraw-Hill books are available at special quantity discounts to use as premiums and sales promotions, or for use in corporate training programs. ![]() This book is printed on recycled, acid-free paper containing a minimum of 50% recycled, deinked paper. Printed and bound by Quebecor/Martinsburg. This book was set in the HB1 design in Times Roman by Paul Scozzari of McGraw-Hill Professional’s Hightstown, N.J. The sponsoring editor for this book was Steve Chapman, the editing supervisors were Penny Linskey and Steven Melvin, and the production supervisor was Sherri Souffrance. Except as permitted under the United States Copyright Act of 1976, no part of this publication may be reproduced or distributed in any form or by any means, or stored in a data base or retrieval system, without the prior written permission of the publisher. McGraw-Hill Copyright © 2002 by The McGraw-Hill Companies, Inc. Area array packaging handbook : manufacturing and assembly / Ken Gilleo. Library of Congress Cataloging-in-Publication Data Gilleo, Ken. McGraw-Hill New York Chicago San Francisco Lisbon London Madrid Mexico City Milan New Delhi San Juan Seoul Singapore Sydney Toronto ![]()
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